BooksComputer hardwareProduction engineeringElectrical engineeringComputersHardware
Microelectronics Packaging Handbook: Subsystem Packaging Part III
by Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
Product Details
Author
Tummala, R.R., Rymaszewski, Eugene J., Klopfenstein, Alan G.
Publisher
Springer
Published
1997
Pages
628
Binding
Hardcover
Edition
2nd
ISBN
9780412084515
Language
English
Genre
Computer hardware, Production engineering, Electrical engineering, Computers, Hardware
Category
Books