BooksElectronics: circuits and componentsMicrowave technologyScience: general issuesElectrical engineeringCircuits & components
Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging
by Wei, Xing-Chang
Product Details
Author
Wei, Xing-Chang
Publisher
CRC Press
Published
2020
Pages
322
Binding
Paperback
Edition
1
ISBN
9780367573669
Language
English
Genre
Electronics: circuits and components, Microwave technology, Science: general issues, Electrical engineering, Circuits & components
Category
Books